Capabilities
Design & Manufacturing
Aerospace Semiconductor’s commercial aviation, space, defense and mining markets demand a broad range of capabilities to successfully deliver semiconductor circuit solutions reliably to our valued customers. We are fully capable of a turnkey design and manufacturing of high performance circuits for a variety of substrates, packages and using assembly techniques all aimed at providing our customers with the performance they demand.
Our in-house capabilities include:
Electrical Testing
DC & AC Testing
Temperature Testing
Data Recording
Sealing
Vacuum solder seal oven
Seam Seal
Cap Welding
Ceramic Lid/Epoxy
Glob Top
Substrates
Thick Film – Alumina, BeO, AlN
Thin Film – Alumina, BeO
Direct Bond Copper
Polyimide, G10, Flex
Design and Manufacturing
Chip & Wire Hybrids
Multi Chip Modules
Surface Mount Hybrids
Chip On Board
Power Hybrids
Custom Packaging
Legacy Components
Assembly
Die Attachment; Epoxy, Solder, Eutectic
Wirebonding; Gold & Aluminum Ball Wedge, 1 to 20 mils wires, high speed automated bonder
Surface Mount
Plastic ecapsulation/over-mold
Screening
Constant Acceleration
Temperature Cycling
Hermetic; Fine and Gross Leak Check
Burn In